
Date: 2/3/2009
Targeting IEEE 802.11b/g/n applications in the 2.4-2.5GHz frequency range, the new LX5552 and LX5551 FEMs complement the reduced PCB area requirement with the provision of integrated on-chip input and output matching circuitry and an integrated power amplifier to both reduce RF design complexities and lower the BOM costs.
Microsemi Corporation has launched a pair of FEMs (front-end modules) for IEEE 802.11b/g/n applications in the 2.4-2.5GHz frequency range that reduce the board space requirement of a typical WiFi implementation by almost 50 percent.
The new LX5552 and LX5551 FEMs complement the reduced PCB area requirement with the provision of integrated on-chip input and output matching circuitry, reduced RF design complexities and lower bill of material costs. Both modules also feature an integrated power amplifier, 50 ohm input and output matching, and single-pole-double-throw (SPDT) switch.
The LX5552 integrates a low noise amplifier (LNA) for improved system performance while saving nearly 50 percent of the board area required for alternative discrete implementations. The LX5551 targets applications that don’t require the LNA, and offers a >30 percent reduction in board space requirement compared to a discrete design. The two devices are offered in a low-profile 3x3mm 16-pin MLPQ package.
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