Low-Vin, Low Drop-Out Regulators

Low-Vin, Low Drop-Out Regulators Deliver Precision Power for Core Voltage Rails

Analog Devices, introduces a new family of low drop-out regulators (LDOs) optimized for low input voltage and output voltage operation where low-noise power is needed.

Available in 800-mA, 1.2-A and 2-A load current ranges, the low-Vin, single-rail input ADP1740, ADP1741, ADP1752, ADP1753 and ADP1754 LDOs offer improved conversion efficiency and superior PSSR (power supply rejection ratio) to support today’s high-performance signal chains. In addition, the new devices offer reduced component count and improved thermal performance, all of which results in lower noise, higher reliability and smaller solutions for designers developing medical imaging equipment, servers, infrastructure, office automation and industrial applications.

“Circuit designers involved with medical and industrial applications require highly reliable, low-noise regulator blocks that provide cleaner bias rails with improve energy utilization. The new ADI LDOs were designed with these applications in mind,” said Walt Heinzer, Marketing Manager, Analog Devices. “These LDO products convert directly from 1.6-V to 3.6-V inputs while delivering -60 dB at 100 KHz PSRR and 160mV at2A drop-out performance. They provide the easiest way to ensure a high-resolution data acquisition system, or any other high-performance signal chain, meets its target specs.”

Power Savings and Easier Layout
While many traditional LDOs can only operate down to inputs of 2.5 V, or require a second power input to convert from less than 2.5 V, the ADP174x and ADP175x families operate on voltages as low as 1.6 V. This reduces the power wasted when converting from higher inputs, and makes PCB layout much easier. The devices also incorporate “enable” and “power good” pins that make system health monitoring easy in mission-critical applications, such as 24 x 7 servers and medical imaging equipment.

Improved Reliability
System reliability is another important design consideration, especially for medical and industrial applications. Insufficient thermal management often results in lower IC reliability. To address this, the ADP174x and ADP175x LDOs are housed in a 4 mm x 4 mm leadless frame chip-set package (LFCSP) with an exposed pad. The exposed EPAD conducts heat away from the LDO, improving thermal conduction to help avoid potential failures, while providing a small footprint.

Availability and Pricing
Samples of the ADP174x and ADP175x LDOs are available now in a 4 mm x 4 mm 16 lead LFCSP packaging.

Click on the more information link below for details.