New Design-Friendly Interworking Card and Application

New Design-Friendly Interworking Card and Application

Utilising Wintegra’s powerful WinPath2™ on-board network processor Interphase Corporation’s new high-performance Internetworking card is designed to bridge cell-based and circuit-based networks and deliver unprecedented performance and outstanding design value.

Embedded networking and communications specialist Interphase Corporation has introduced a high-performance Internetworking card for bridging cell-based and circuit-based networks. Based on the powerful Wintegra™ WinPath2™ on-board network processor the iSPAN® 3650 AdvancedMC™ (AMC) Quad OC-3c/STM-1 ATM-IP Interworking Card  delivers unprecedented performance and outstanding design value, and is able to support:

• 64,000 ATM PVCs (Permanent Virtual Circuits)
• 1 M/s AAL2 CPS packets
• 50,000 Active CIDs supported for AAL2 PVCs

When combined with Interphase’s Interworking application, the iSPAN 3650 becomes an integrated gateway on an AMC, especially designed to support OC-3c/STM-1 interfaces in ATCA and MicroTCA (µTCA)-based systems. This configuration provides an excellent value proposition for equipment manufacturers seeking to expand capability of existing products and for network service providers seeking to reduce costs by foregoing expensive external ATM gateways.

For both AAL2 and AAL5 data, the ATM-IP Interworking application enables the transport over IP for voice, data, and control traffic to/from other processing units via the Gigabit Ethernet (GE) backplane. Other available protocol stacks include UDP/IP over GE and GTP-U tunneling. Fully embedded on the iSPAN 3650 card the software includes the protocol layers, the management and configuration plane, the line/equipment protection, and the data interworking application. The GTP-U tunneling capability makes this gateway AMC an ideal solution for wireless network elements that connect to the 3GPP Iu interface, such as 3G RNCs, SGSNs, Femtocell/HNB gateways, and LTE Serving gateways.

For further details click on the more information link provided below.